3D-Via Driven Partitioning for 3D VLSI Integrated Circuits
نویسندگان
چکیده
منابع مشابه
3D-Via Driven Partitioning for 3D VLSI Integrated Circuits
A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. However, 3D-vias can impose significant obstacles and constraints to the 3D placement problem. Most of the existing placement algorithms completely ignore this fact, but they do optimize the number of vias using a min-cut p...
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ژورنال
عنوان ژورنال: CLEI Electronic Journal
سال: 2010
ISSN: 0717-5000
DOI: 10.19153/cleiej.13.3.1